Welcome to Ascomp Inc.


SKU: 12345670 BRAND: Dinghua

A style of hot –air rework station controlled by meter that can repair all kinds of chips in computer such as south-north Bridge Chip of Mother board, display card, cell phone, digital camera, projector and games player.


  • Embedded industrial PC, high definition touch screen, make the operation humanity, CPU control, and instant curve analysis function. Real-time display settings and actual temperature curve, which can also be used to analyze and correct the curve if necessary.
  • It uses high precise k-type thermocouple closed-loop control and automatic temperature compensation system, with CPU and temperature module to enable precise temperature deviation to add and subtract 2 degrees. Meanwhile, external temperature measurement connector enables temperature diction and accurate analysis of real time temperature curve.
  • V-groove PCB works for rapid, convenient and accurate positioning, which can meet all kinds of PCB board of positioning.
  • Flexible and convenient removable fixture on the PCB board can protect the PCB fringe devices from damaging and transmuting. It can also adapt to various BGA ‘s reworking.
  • Various sizes of BGA alloy nozzles, which can be adjusted 360 degree for easily installation and replacement.
  • Three temperature areas can independently heat and they are multiple temperature control, which can ensure best integration of different temperature areas. Heating temperature, time, slope, cooling and vacuum can all be set in the human-machine interface.
  • There are 8 stage temperature controls up and down. Massive storage of temperature curves which are accessible at any time according to different BGA. Curve analysis, setting and adjustment are also accessible via touch screen. Three heating areas adopt independent PID calculation to control heating process to enable more accurate temperature.
  • It uses high power cross-flow fan to enable fast cooling of PCB board and prevent PCB from deformation. There are also internal vacuum pump and external vacuum chuck, which can help to fetch the BGA chip


  • Total Power :5300W
  • Power : AC220V±10% 50Hz
  • Optical CCD camera lens:90°open/folding
  • Camera magnification :10x - 220x
  • Temp accuracy :±1?
  • PCB size :Max 370×410 mm Min 22×22 mm
  • BGA chip :1x1 - 80x80 mm
  • Minimum chip spacing :0.15mm
  • External temper sensor : 1pc
  • Dimensions :530x670x790mm
  • Net weight :70KG
  • Auto/manual operation modes
  • Laser positioning
  • CCD camera alignment system
  • Real time Data &profile analysis
  • Vacuum pick-up pen
  • Industrial PC touch screen