Stencil Cleaning System
Availability
In Stock
Model
Stencil Cleaning System

Features:
  • Safety total pneumatic design. Without power connected, thus to avoid the dangers caused by electrospark.
  • Perfect cleaning effect. 0.1mm of BGA Pore diameter and 0.3mm of QFP spacing, 0201 could all easily be cleaned.
  • Spray with low pressure and high flow capacity, detergent and dry by air convection in room temperature, no breach to the stencil.
  • Pro-environment and low lose design. With the mini circulating system to reuse the detergent.
  • IPA and other common hydrocarbon detergent could be used. Pro-environmental detergents without CFC and of lower VOC are suggested.

Outline Dimension
W650 x D1000 x H1700 mm
Vent Dimension
70x50mm(H) Max wind speed 3m3/Sec
Stencil Dimension
750mm*750mm/40mm(Max)
Solvent bath content
60L (Max)/ 25L (MIN) Best used 40L
Cleaning Time
5 Min(Solder paste) ; 6Min (Glue)
Drying Time
3 Min
Solvent Wastage
0.03-0.05L Per stencil
Working Mode
Both sides of the rotary jet (Cleaning)
High-Pressure air injection (Drying)
Filter
1st:5um * 1Pcs (for solder power)
High-pressure air injection (drying)
Air Supplying Pressure
0.5MPa`0.7MPa; 600 L Min-800L/Min
Material
Stainless Steel + Corrosion –resistant Paint
Weight
300kg
Option
PCB Holder

What We Do

We provide high quality of products at a very competetive price. We emphasis highly on the quality of our service and therefore strive hard on timely delieveries and on imparting excellent post-sales service.

Contact Us

+91-11-45501226
+91-11-45501227
+91-11-28116200
+91-11-45501228
info@ascompinc.com

Twitter

Facebook