BGA Rework Stations

SKU: 12345670 BRAND: The Ascomp Inc

A style of hot –air rework station controlled by meter that can repair all kinds of chips in computer such as south-north Bridge Chip of Mother board, display card, cell phone, digital camera, projector and games player.


BGA Rework Stations
DESCRIPTION OF DH-5830

  • Torque Adjustment stepless from 0.6 – 1.5 N.m
  • 24V DC power supply
  • Semi-auto, low spoilage
  • Economical and durable
  • Japanese Motor
  • RPM: 400-900
  • Bit shank(mm) 1/4 "
  • Screw Size 9mm) M2-M3.5
  • Weight 625 Gram
BGA Rework Stations
DESCRIPTION OF DH-A2

  • Embedded industrial PC, high definition touch screen, make the operation humanity, CPU control, and instant curve analysis function. Real-time display settings and actual temperature curve, which can also be used to analyze and correct the curve if necessary.
  • It uses high precise k-type thermocouple closed-loop control and automatic temperature compensation system, with CPU and temperature module to enable precise temperature deviation to add and subtract 2 degrees. Meanwhile, external temperature measurement connector enables temperature diction and accurate analysis of real time temperature curve.
  • V-groove PCB works for rapid, convenient and accurate positioning, which can meet all kinds of PCB board of positioning.
  • Flexible and convenient removable fixture on the PCB board can protect the PCB fringe devices from damaging and transmuting. It can also adapt to various BGA ‘s reworking.
  • Various sizes of BGA alloy nozzles, which can be adjusted 360 degree for easily installation and replacement.
  • Three temperature areas can independently heat and they are multiple temperature control, which can ensure best integration of different temperature areas. Heating temperature, time, slope, cooling and vacuum can all be set in the human-machine interface.
  • There are 8 stage temperature controls up and down. Massive storage of temperature curves which are accessible at any time according to different BGA. Curve analysis, setting and adjustment are also accessible via touch screen. Three heating areas adopt independent PID calculation to control heating process to enable more accurate temperature.
  • It uses high power cross-flow fan to enable fast cooling of PCB board and prevent PCB from deformation. There are also internal vacuum pump and external vacuum chuck, which can help to fetch the BGA chip
BGA Rework Stations
DESCRIPTION OF KID-R450

  • High quality heating material produces high temperature air, precise controlling BGA soldering and desoldering.
  • Movable heater can move to all direction for easy operation.
  • Upper/lower hot air set up accurate temperature controlling with bottom IR constant temperature heating zone and reasonable temperature-controlling system ensuring safe reparation.
  • Upper hot air 8 segment temperature up (down) +8 segment constant temperature control with 10 groups temperature setting savable. Lower hot air 8 segments temperature up(down)+8 segments constant temperature control with 10 groups temperature setting savable and computer communication function is provided.
  • BGA soldering zone supporting frame can be fine adjusted the height to prevents the depression of soldering area.
  • Multi-function PCB fixing frame locates PCB quickly and conveniently as well as suitable for irregular shape board.
  • Powerful cross flow fan cools down lower heating zone instantly.
  • Beep alarming function when soldering or desoldering finished. hand vacuum suction pen picks away BGA easily.
  • Equipped with over temperature alarming and protection function for both upper and lower heating zone.
  • Equipped with a couple of different sizes alloy nozzles that are easy to be replaced and can be customized based on practical needs.
  • Solid status relay caution light secures safe temperature controlling.
BGA Rework Stations
DESCRIPTION OF POL-801

  • Torque Adjustment stepless from 0.6 – 1.5 N.m
  • 24V DC power supply
  • Semi-auto, low spoilage
  • Economical and durable
  • Japanese Motor
  • RPM: 400-900
  • Bit shank(mm) 1/4 "
  • Screw Size 9mm) M2-M3.5
  • Weight 625 Gram
BGA Rework Stations
DESCRIPTION OF Anti-static Chair

  • Anti-static Black Colour, Seat- 18 x 17" Approx.
  • Back- 16 x 12" Approx Push Back Type
  • Height adjustment- 17-22" Approx.
  • Plastic Five Star Foot rest, Plastic Castors
  • Conductive Metal Chain
BGA Rework Stations
DESCRIPTION OF Sponge Sheet

  • Size: 440 x 300 mm
  • Thickness: 1.2mm
BGA Rework Stations
DESCRIPTION OF DH-5830

  • Embedded industrial PC, high definition touch screen, human-machine interface operation, PLC control, and instant curve analysis function. Real-time display settings and actual temperature curve, which can also be used to analyze and correct the curve if necessary
  • It uses high precise k-type thermocouple closed-loop control and automatic temperature compensation system, with PLC and temperature module to enable precise temperature deviation to add and subtract 2 degrees. Meanwhile, external temperature measurement connector enables temperature diction and accurate analysis of real time tempera
  • V-groove PCB works for rapid, convenient and accurate positioning, which can meet all kinds of PCB board of positioning
  • Flexible and convenient removable fixture on the PCB board can protect the PCB fringe devices from damaging and transmuting. It can also adapt to various BGA ‘s reworkin
  • Various sizes of BGA alloy nozzles, which can be adjusted 360 degree for easily installation and replacement.
  • Three temperature areas can independently heat and they are multiple temperature control, which can ensure best integration of different temperature areas. Heating temperature, time, slope, cooling and vacuum can all be set in the human-machine interface
  • There are 6-8 temperature controls up and down. Massive storage of temperature curves which are accessible at any time according to different BGA. Curve analysis, setting and adjustment are also accessible via touch screen. Three heating areas adopt independent PID calculation to control heating process to enable more accurate temperature.
  • It uses high power cross-flow fan to enable fast cooling of PCB board and prevent PCB from deformation. There are also internal vacuum pump and external vacuum chuck, which can help to
  • Collocating with sound control "early warning" function. It can warn workers to make some relative preparation 5-10 seconds before the completion of uninstalling or welding. Cooling system will start after vertical wind stopped heating. When the temperature drops to normal temperature, the cooling process will stop automatically, so that the machine will not be aging after temperature heated up
  • It approved CE certification, and this appliance was equipped with emergency stop switch and automatic power-off protection device when emergency happens
SPECIFICATION OF DH-5830 :
  • Total Power: 4800W
  • Top heater 800W
  • Bottom heater 2nd 1200W, 3rd IR heater 2800W
  • Power AC220V±10% 50Hz
  • Lighting Taiwan led working light, any angle adjusted.
  • Operation mode HD touch screen, intelligent conversational interface, digital system setting
  • Positioning Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures.
  • Temperature control K sensor, close loop
  • Temp accuracy ±2℃
  • PCB size Max 410×370 mm Min 22×22 mm
  • BGA chip 2x2 - 80x80 mm
  • Minimum chip spacing 0.15mm
  • External temper sensor 1pc
  • Dimensions 570*610*570mm
  • Net weight 33KG
SPECIFICATION OF DH-A2 :
  • Total Power :5300W
  • Power : AC220V±10% 50Hz
  • Optical CCD camera lens:90°open/folding
  • Camera magnification :10x - 220x
  • Temp accuracy :±1℃
  • PCB size :Max 370×410 mm Min 22×22 mm
  • BGA chip :1x1 - 80x80 mm
  • Minimum chip spacing :0.15mm
  • External temper sensor : 1pc
  • Dimensions :530x670x790mm
  • Net weight :70KG
  • Auto/manual operation modes
  • Laser positioning
  • CCD camera alignment system
  • Real time Data &profile analysis
  • Vacuum pick-up pen
  • Industrial PC touch screen
SPECIFICATION OF KID-R450 :
  • Model KID-R450
  • PCB size L460mm x W370mm
  • Applicable BGAs2*2-6 0*6 0mm
  • PCB fixing wayouter or frame
  • Bottom Pre-heating IR 2400W
  • Lower heater Hot air 800W
  • Upper heater Hot air 600W
  • 600W Power apply Single–phase 220V, 50/60 Hz
  • Machine size L620mm x W600mm x H650mm
SPECIFICATION OF KID-R450A :
  • Model KID-R450A
  • PCB size W460 x D370mm
  • Applicable BGAs2*2-60*60mm
  • Max BGA weight80g
  • PCB locating wayouter or jig
  • Bottom preheaterfar infrared,2400W
  • Lower heaterhot air, 800W
  • Upper heaterhot air, 600W
  • Powersingle-phase, 220V、50/60Hz
  • Machine sizeL620*W600*H650mm
SPECIFICATION OF KID-R450:
  • Model KID-R450
  • PCB size L460mm x W370mm
  • Applicable BGAs2*2-6 0*6 0mm
  • PCB fixing wayouter or frame
  • Bottom Pre-heating IR 2400W
  • Lower heaterHot air 800W
  • Upper heaterHot air 600W
  • Power apply Single–phase 220V, 50/60 Hz
  • Machine size L620mm x W600mm x H650mm
SPECIFICATION OF XDL-200
  • Models XDL-200
  • Capacity 202L
  • External Dimension W600*D672*H632mm
  • Internal Dimension W598*D645*H524mm
  • Shelves2 k units size: W555*D530*H20mm/unit)
  • Power Consumption Ave.- 55Wh Max.- 295W
SPECIFICATION OF DH-5830 :
  • Total Power: 5300W
  • Hot air 200W
  • Hot air 1200W,infrared 2700W
  • AC220V ±10% 50/60Hz
  • L530*W670*H790 mm
  • V-grove PCB support,and with external universal fixture
  • K type thermocouple, closed loop control,independent heating
  • ±2℃
  • Max 450*490mm,Min 22*22 mm
  • ±15mm forward/backward ±15mm right/left
  • 80*80-1*1mm
  • 0.15mm
  • 1 optional
  • 70kg